Abstract: The low-cost and low-electromagnetic-interference (EMI) packaging of optical transceiver modules employing housings of plastic composites are developed and fabricated. Optical transceiver ...
Abstract: Silicon interposers are providing interesting alternatives to organic packages for the fabrication of complex system in package (SIP) modules in particular for RF application. Among the ...
AUBURN HILLS, MI—BorgWarner Inc. has secured a contract with a major North American automaker to provide an 800-volt secondary integrated drive module (iDM) and a generator module incorporating a dual ...
The connection module VM-Pro 8-8 Class FA IP67 by Telegärtner offers transmission properties up to Class FA acc. to ISO/IEC 11801 and is suitable for installation and patch cables with 8 wires.
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