A new IEEE technical paper titled “Package Assembly Design Kits (PADK’s)- The Future of Advanced Wafer-Level Manufacturing” was written by researchers from Amkor. Find the technical paper here.

VANCOUVER, British Columbia, Jan. 15, 2025 (GLOBE NEWSWIRE) — Highland Copper Company Inc. (TSXV: HI; OTCQB: HDRSF) (“Highland” or the “Company”) is pleased to announce the awarding of the Front-End ...

More heterogeneous designs and packaging options add challenges across the supply chain, from design to manufacturing and into the field. Advanced packaging may be the best way forward for massive ...

Members can download this article in PDF format. Today, advances in semiconductors and ICs are producing ever smaller and denser circuits. With that comes the challenge of efficiently packaging and ...

Three independent design processes – chip, package, and PCB – are typically required for the latest electronic products which utilize increasingly complex systems on chip (SoCs) and multiple chips in ...

Consumer electronics – tablets, smartphones and e-readers – is now leading the industry in growth. For system manufacturers and integrated circuit (IC) suppliers, the challenge involves keeping pace ...

Packaging science goes far beyond mere protection and containment. It's a bridge between products and consumers, serving as a powerful tool for marketing, sustainability, and innovation. This is where ...

The Engineering Design program is intended for students whose academic/scientific interests aren’t aligned with an existing engineering discipline or limited to one engineering discipline. The ideal ...

The Company has adopted a phased approach to engineering with the initial step of finalizing design criteria for critical areas and assessing key opportunities to improve the Project. The FEED work ...