As device scaling slows down, a key system functional integration technology is emerging: heterogeneous integration (HI). It leverages advanced packaging technology to achieve higher functional ...

For the first time in decades, Intel is playing from behind in the race to cram smaller and smaller transistors on squares of silicon. But the semiconductor giant recently rolled out one of its most ...

Every Wednesday and Friday, TechNode’s Briefing newsletter delivers a roundup of the most important news in China tech, straight to your inbox. Sign up Traditionally, packaging has been considered a ...