(Nanowerk News) Imec presents a via-middle through-Si-via (TSV) approach to 3D stacking. This method is new to industry as it allows to 'reveal' TSV contacts by using a Si-etch process. The process ...
Stacked die and fan-outs gain steam as shrinking features becomes more difficult. Where the biggest hurdles are and what’s being done about them. After a number of false starts and lackluster adoption ...
The consortium is a national initiative and supported by the Singapore Economic Development Board (EDB) and A*STAR. IME is teaming up with A*STAR’s Institute of High Performance Computing (IHPC) and ...
EVG's new integrated in-line metrology module can detect a variety of process irregularities and defects during temporary bonding and debonding, including: total thickness variation (TTV) of the ...
One issue with the adoption of TSVs in 3D ICs in mainstream semiconductor applications revolves around the throughput of the temporary wafer bonding and debonding process. This doesn’t necessarily ...
SINGAPORE--28/08/2012, UNITED STATES--(Marketwire -08/27/12)- STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST:STATSChP), a leading semiconductor test and advanced packaging service ...
Applied Materials and Japan-based Disco have announced a joint effort to develop wafer thinning processes for fabricating through-silicon vias (TSVs) in 3-dimensional (3D) semiconductors. Save my User ...
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