Micro-electro-mechanical systems have been available for years, and have been successful in selected high-volume applications. But MEMS design is not as organized as it could be. MEMS design typically ...
Automotive applications, particularly those related to AI and computer vision, are a significant driver of the current semiconductor boom. Established companies are mostly thriving, it’s true, but ...
The FICS Research Institute (University of Florida) has published a new research paper titled “Secure Physical Design.” This is the first and most comprehensive research work done in this area that ...
SpringSoft Completes OpenAccess-Compatible IC Layout Flow with Enhancements to Laker ADP Design Entry System The Laker™ Advanced Design Platform integrates the full-featured Laker schematic editor, ...
WAYNE, N.J. — EDA giant Cadence Systems is hoping to ease the development of wireless systems, with the release of an RF IC design flow on Monday (Jan. 24) that includes the company's new Assura RF ...
IROC Technologies faced developing an integrated circuit (IC) - from scratch - with limited internal IC design resources. To meet the aggressive tapeout schedule, IROC needed to feel confident in the ...
SAN JOSE, Calif. & HSINCHU, Taiwan--(BUSINESS WIRE)--United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (UMC), a leading global semiconductor foundry, and Cadence Design Systems, Inc. (Nasdaq ...
Ansys® Redhawk-SC™ and Ansys® Redhawk-SC Electrothermal™ multiphysics power integrity and 3D-IC thermal integrity platforms are certified as compliant with TSMC's 3Dblox standard for 3D-IC design ...
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