EDN

Socket vendors take on 0.5-mm pitch

The single biggest headache for test engineers is the ever-finer pitch of ball grid array and chip-scale package sockets. The migraines really begin at fine pitches of 0.5 mm, a point where shrinking ...
EDN

Socket your BGA package using elastomer socket with superior electrical performance

Ironwood Electronics has recently introduced a new high performance elastomer socket for 0.4mm pitch BGA package. The SG25-BGA-2042 socket is designed for a 4.47mmx4.34mm package size and operates at ...
Electronic Design

Test Socket’s CAM Lid Guards Package Pads

Test Socket's CAM Lid Guards Package Pads Damage to package pads is preventable thanks to a line of high-frequency test sockets. These sockets feature a computing-aided manufacturing (CAM) lid that ...
Electronic Design

Different BGA Packages Accommodated By BGA Socket

The Configurable High Insertion Count (CHIC) Socket lets users of programming and automatic test equipment accommodate any BGA package. It improves electrical contact reliability compared to ...
Electronics Weekly

Socket for Array Area and Peripheral Package Test

Galileo is a test socket engineered to support today’s high performance Digital and RF applications. It leverages proven interposer elastomer technology and advanced 3D printing manufacturing to ...
Hackaday

Parts: Chip Sockets For Dual In-line Package (DIP)

DIP through-hole chips are an old package with instantly recognizable dual in-line pin rows. Beginners love these chips because they’re large and look easy to solder; we abhor them because we hate ...