SEM (scanning electron microscope) images of test chip designed by Deca. Upper left show a molded multi-chip fan-out package with close-ups of the embedded die right and below The last time I wrote ...

As demand for faster, smaller, and more energy-efficient electronics intensifies, advanced packaging has emerged as a critical enabler of progress in the semiconductor industry. By integrating ...

In a milestone for the global semiconductor industry, Multibeam Corp. today introduced the MB platform, a first-of-a-kind Multicolumn E-Beam Lithography (MEBL) to make chip factories better. Their new ...

The group is also building an OSAT facility. This is in view of a larger plan to create a hub for chiplet integration and ...

Broadcom Inc. today detailed a new chip packaging technology, XDSiP, that makes it possible to create processors by stacking multiple silicon dies atop another. XDSiP is short for eXtreme Dimension ...

GlobalFoundries, a semiconductor manufacturing company with locations around the world, invested $575 million to build the new center, as well as an additional $186 million for research and ...

The semiconductor companies and startups on the front lines of the AI chip market are competing over scale as much as anything else. They’re all racing to roll out giant graphics processing units ...

Processors Intel signals the end for its 12th Gen Core processors, though the architecture lives on under the guise of its 13th and 14th Gen Memory Explainer: The RAMpocalypse is making memory, SSDs, ...

To enhance the performance of advanced logic and memory chips required for AI computing, global semiconductor equipment leader Applied Materials has unveiled new semiconductor manufacturing systems.

MALTA, N.Y. (NEWS10) — GlobalFoundries will create a new center for chip packaging and testing in Malta, the company announced on Friday. The facility will be called the New York Advanced Packaging ...