Intel Corporation and Arizona-based 3D Glass Solutions (3DGS) are exploring a $3.3-billion investment in Odisha to set up India’s first advanced semiconductor glass core packaging substrate ...

LG Chem, Asahi Kasei, and Sumitomo Chemical—have collectively announced plans for capacity expansion, technical cooperation, ...

The fight over who makes the world’s chips is increasingly a fight over the parts of a chip nobody photographs. India has just landed one of them. Intel and 3D Glass Solutions have signed an agreement ...

The market for fan-out panel-level packaging (FO-PLP) and glass substrates is set to grow more than tenfold in five years, as Intel, TSMC, and others race to adopt the large-area packaging that ...

Glass substrates are considered one of the key directions for advanced packaging development, especially showing significant potential in high-performance computing (HPC) and data center sectors.

Intel (INTC) is attempting to reposition itself in the semiconductor value chain by leveraging one of the few areas where it still holds a differentiated capability—advanced packaging. While Taiwan ...

Intel has unveiled a glass core substrate for future semiconductor advanced packaging. Expected to be ready for the end of the decade for both Intel and Intel Foundry customers, the company believes ...

Intel (NASDAQ:INTC) is one of the 15 AI Stocks Analysts Are Watching: Microsoft, Nvidia, and More. Intel Corporation may benefit from tailwinds coming from advanced packaging technologies, which has ...

TAIPEI, May 29 (Reuters) - Taiwan ⁠chip ⁠designer MediaTek said on ⁠Friday it supports both TSMC's and Intel's advanced packaging technologies, allowing customers to choose between the two approaches.