LONDON — Fujitsu Ltd.'s semiconductor division today announced development of a high-density, multi-chip package capable of holding up to eight stacked devices. The company said it is using a new chip ...
Assembly and test house ChipPAC Inc. said today it is ready to produce a 10mm by 14 mm by 1.2mm four chip stacked package, what it claims is the world's thinnest. The package can house four different ...
Deemed the first all-DRAM stacked memory package using through silicon via (TSV) technology, the company's wafer-level-processed stacked package (WSP) consists of four 512-Mb DDR2 DRAM chips that ...
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