In our previous article on Ball Grid Arrays (BGAs), we explored how to design circuit boards and how to route the signals coming out of a BGA package. But designing a board is one thing – soldering ...

Product Briefing Outline: Reis Robotics has now implemented a newly developed laser soldering procedure for practical use with several customers. Photovoltaics manufacturers are increasingly anxious ...

PHOENIX--(BUSINESS WIRE)--Spirit Electronics, a value-added microelectronics distributor, is rolling out additional capacity for its automated BGA reballing service. Spirit’s high-efficiency ...

Electronic devices continue to shrink in size with advancement in chip fabrication technology. Packaging technology has responded with improved formats to present these chips for assembly to PCBs.