The Simcenter Micred Quality Tester from Siemens enables the assessment of a semiconductor package's thermal structure to identify manufacturing defects, including die-attach issues. With the ...

Recent advances in electronic equipment demand more compact, lighter and functionally superior components. Die-bonding film is widely used in semiconductor packaging in electronic equipment such as ...

A technical paper titled “Fabrication and Characterization of Three-Dimensional Microelectromechanical System Coaxial Socket Device for Semiconductor Package Testing” was published by researchers at ...

ASE Technology (NYSE:ASX) delivers semiconductor assembly, testing, and IC packaging services, supporting engineering, supply ...

In this work, we propose a new signal routing method for solving routing problems that occur in the design process of semiconductor package substrates. Our work uses a topological transformation of ...

University of Texas at Austin engineers advance semiconductor manufacturing with 3D printing - supported by a $14.5 million grant from DARPA.

A research team at UT Austin has introduced a new technique that could redefine how semiconductor components are designed and ...

Scientists have long sought to make semiconductors—vital components in computer chips and solar cells—that are also superconducting, thereby enhancing their speed and energy efficiency and enabling ...

Knowledge of the atomic-level structures of materials is extremely important for correlating the properties and functions of material in any scientific discipline, including chemistry, biology, and ...

IC packaging is a technique for shielding semiconductor equipment from ambient physical damage or degradation by wrapping them in ceramics or polymer packaging materials. There are several varieties ...

TOKYO--(BUSINESS WIRE)--Dai Nippon Printing Co., Ltd. (DNP, TOKYO: 7912) has developed a highly reliable manufacturing technology that configures a high definition silver plated area for lead frames ...