The market for system-in-package (SiP) substrates is already tight and will become tighter as Apple is looking to adopt SiP technology in more of its AirPods series, according to sources at ...

IZMO today announced that its specialized division, izmo Microsystems, has successfully designed a high complexity 3D System-in-Package (SiP) module for Space Payload Camera Electronics. This ...

Nan Ya PCB has delivered samples of SiP substrates for processing 5nm chips for validations by clients and expects to kick off shipments of such substrates by the end of 2020 at the earliest, which ...

System-in-package (SiP) is quickly emerging as the package option of choice for a growing number of applications and markets, setting off a frenzy of activity around new materials, methodologies, and ...

LG Innotek developed the world's first "copper post" technology, a solution needed for the latest smartphones. This technology allows for denser circuitry for smaller, higher-performance semiconductor ...

System-in-Package (SiP) technology has been used for a wide range of electronic devices, but the warpage behavior of the package can be difficult to control and predict due to complex manufacturing ...

RF SiP technology is an enabling packaging platform for wireless communication, which is constrained by the fact that, today, SiP design is an “expert engineering” process—one that is not scalable as ...