TOKYO--(BUSINESS WIRE)--Dai Nippon Printing Co., Ltd. (DNP, TOKYO: 7912) has developed a highly reliable manufacturing technology that configures a high definition silver plated area for lead frames ...
Already tapping into the quad-flat-pack-no lead (QFN) packaging segment from 2006, packaging houses Greatek Electronics and Lingsen Precision Industries (LPI) both regard QFN as key to driving their ...
DNP has taken advantage of our microfabrication technology developed over many years to successfully achieve the configuration of lead frame silver plated area of ±25um. It has also been possible to ...
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