EDN

IC packages and thermal design

Don't be so stuck in the circuits that you forget the importance of IC packages. Here are a couple cards from the Microchip 2005 product selector: While most design engineers are using surface mount ...
Semiconductor Engineering

A High-Level ‘How To’ Guide For Effective Chip-Package Thermal Co-Design

Concurrent design of a chip and its packaging environment is becoming more important than ever for several reasons. Designing a large, high power die, e.g. a System-on-Chip (SoC), without considering ...
Semiconductor Engineering

High Performance, Multi-Chip Leadframe Package With Internal Connections

For high performance applications, demand for highly integrated packages has increased. This is due to the highly integrated package’s electrical performance advantages of reduction of interchip ...
EDN

3D chip/package/PCB co-design optimizes systems: Product how-to

Three independent design processes – chip, package, and PCB – are typically required for the latest electronic products which utilize increasingly complex systems on chip (SoCs) and multiple chips in ...
Electronic Design

Smallest Hermetic Surface Mount Package for Transistors And Diodes

Microsemi Corporation introduced the industry's smallest hermetic surface mount package for power transistors and diodes. Microsemi pioneered the development of the new industry-standard U4 package, ...
Business Wire

Transphorm Adds Industry-Standard TO-263 (D2PAK) to Its Surface Mount Package Offerings, Extending SuperGaN Platform Benefits

GOLETA, Calif.--(BUSINESS WIRE)--Transphorm, Inc. (Nasdaq: TGAN)—a pioneer in and global supplier of high reliability, high performance gallium nitride (GaN) power conversion products—today announced ...