Teknovus, a Petaluma startup that makes computer chips and software for fiber optic communications, has accepted a $123 million takeover offer from Broadcom Corp., the two companies said Wednesday.

Why AI needs high-speed interconnects. How multichannel fiber meets AI demands. How multichannel fiber support fits on a chip. Though copper provides high-speed connectivity, it has limitations. One ...

The advent of big data era raising significant challenges in information processing, especially in the aspect of capacity and power consumption. Situations become even worse when we consider the fact ...

Quantum engineers have now demonstrated a fully controllable three‑qubit register on a silicon photonic chip, turning a ...

How a single silicon chip was designed to be microwave and optical signal-processing engine. The various roles for which this engine can be reconfigured. The performance considerations that were ...

Researchers develop ultra-fine 3D printing tech for vertical nanolasers, enabling high-density optical chips for AI, AR ...

SpaceX’s rapid expansion in launch services and satellite broadband is creating a powerful, if indirect, tailwind for a ...

Despite TSMC estimating that the mass production of silicon photonic (SiPh) co-packaged optics (CPO) technology will still require more than one to one and a half years, the optical communication ...

The U.S. Defense Advanced Research Projects Agency (DARPA) will fund a four-year program to develop optical interconnect technology for chip-to-chip communications, headed by researchers at IBM Corp.

San Jose, Calif. — Optical technology is being eyed as a way to boost communications between chips in multiprocessor systems and will be the subject of a proposed specification to be submitted to a ...