A SPICE model based on the BSIM3 core eliminates shortcomings in the existing level 1 and level 3 subcircuit models, enabling better simulation of trench-type power MOSFETs. An improved SPICE model ...
A University at Buffalo team has proposed a new form of power MOSFET transistor that can handle incredibly high voltages with minimal thickness, heralding an efficiency increase in the power ...
Texas Instruments Incorporated is expanding its MOSFET driver portfolio with three next-generation two-output gate drivers that improve efficiency and reliability in high-density isolated power ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback