Why should there be an interest in Package Assembly Design Kits (PADK) today? For the most part, it is due to the advancement in the accumulation of files forming the PADK now offering a customized ...

A new IEEE technical paper titled “Package Assembly Design Kits (PADK’s)- The Future of Advanced Wafer-Level Manufacturing” was written by researchers from Amkor. Find the technical paper here.

TEMPE, Ariz.--(BUSINESS WIRE)--Amkor Technology, Inc. (NASDAQ: AMKR), a leading outsourced semiconductor packaging and test service provider, today announced the expansion of its collaboration with ...

For many applications, next generation IC packaging is the best path to achieve silicon scaling, functional density, and heterogeneous integration while reducing the overall package size.

Yankee Candle's YC Collection uses a new monogram, curved glass jars, metallic lids, and new fragrances to premiumize its new sub-brand. Coca-Cola just gave this old-school soda brand a DGAF makeover ...

CHANTILLY, Va.--(BUSINESS WIRE)--Dynex Technologies announced today it has finalized a supply agreement with ZEUS Scientific (Branchburg, NJ), allowing ZEUS to utilize the proprietary Dynex SmartKit™ ...

Injection-molded packaging can protect in vitro diagnostic kits and reagents. The ELISA packaging kit is molded from high-impact polypropylene resin and designed with living hinges for secure closure ...