The high-density Searay open-pin-field-interconnect family uses right-angle sockets, allowing connection to perpendicular and high-speed microbackplane applications. The device offers a four-row ...

For leading-edge devices such as RF ICs, increasing frequency, package density, and thermal issues offer significant challenges to designing effective socket and load-board solutions for test.

Answering the call for ever-smaller connectors with increased contact density, LEMO extended its M series of plugs and cable-mount sockets with the ultra-compact MM connectors. Answering the call for ...