Learn more about TI’s latest GaN power ICs and the role that double-sided cooling plays in improving power efficiency and density. Higher switching frequencies with GaN give you the ability to use ...
NXP Semiconductors has claimed the industry’s first top-side cooling solution for RF power, which reduces the thickness and weight of 5G radios by more than 20 percent. The new family of top-side ...
For the PDF version of this feature, click here. In most modern power semiconductor applications there is a need to carefully manage heat. This is true in fields as diverse as mobile communications, ...