SAN JOSE, Calif., March 29, 2011 (GLOBE NEWSWIRE) -- Integrated Silicon Solution, Inc. (Nasdaq:ISSI), a leader in advanced memory solutions, today introduced a family of 512Mb DDR SDRAMs with speeds ...
SAN JOSE, Calif., June 14, 2011 (GLOBE NEWSWIRE) -- Integrated Silicon Solution, Inc. (Nasdaq:ISSI), a leader in advanced memory solutions, today announced the addition of four new products to their ...
Santa Clara, Calif. — Agilent Technologies Inc. said it has introduced the industry's first DDR2 and DDR3 ball-grid array (BGA) probes for oscilloscopes and logic analyzers. For validating memory ...
Hsinchu, Taiwan-based semiconductor testing and assembly services provider ChipMOS Technologies Inc. has signed a one-year ball grid array (BGA) substrate supply agreement with Ryowa Co. Ltd., under ...
Targeting communication applications, the BB1110B and BB2110DI series termination networks accommodate DDR SRAM and employ a BGA connection, said to minimize parasitics. They feature 18-bit SSTH-2 ...
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