EDN

New CMP process for sub-100nm copper and low-k wafers

ACM Research, a two-year-old Californian company, says it can see the end of the road for chemical mechanical polishing (CMP), and is looking to move in on the market with a non-contact process. It ...
EDN

IBM, Rohm and Haas expand partnership to include 32-, 22-nm copper CMP

To bolster high volume manufacturing of the 32- and 22-nm semiconductor manufacturing process nodes, IBM Corp and the Phoenix, Ariz.-based chemical mechanical planarization (CMP) technologies division ...
Business Wire

Applied Materials Extends Copper/Low k Leadership with Innovative CMP Technology; Reflexion LK CMP System Planarizes Delicate Low k Interconnects at High Production Speeds

SANTA CLARA, Calif.--(BUSINESS WIRE)--June 25, 2003--Applied Materials, Inc. (Nasdaq:AMAT) announces Reflexion(R) LK, the industry's only low down force, high throughput CMP (chemical mechanical ...
AZOM

How to Improve Quality Control with Bench-Top Mechanical Testing

Chemical mechanical polishing (CMP) is a process of global planarization that leverages the synergetic effect of chemical reactions and mechanical abrasion to facilitate wafer polishing. CMP has ...