The plastic Ball Grid Array (BGA) and Low profile Fine pitch BGA (LFBGA) packages have developed over recent years from being rarely used devices, to become, for many applications, the first choice ...
The SG-BGA-7064 chip socket accommodates 0.75-mm-pitch ICs with 7.286 x 10.85-mm-footprints. The devices operate in excess in 10 GHz and support dense 48-ball BGA stacked devices using ...
For validating BGA and LGA devices with a 0.65-mm pitch, the company's latest hybrid socket adapter design deploys both male and female pins in an interstitial pattern. Its design provides the ...
Hirose has launched a new ball grid array (BGA) mezzanine connector designed for high-speed data applications, including a ...
The BGA component serves the primary role of redistributing the signals from the die it protects to an interface pattern (the BGA’s balls) compatible with the host PCB it mounts on. As a result, many ...
PHOENIX--(BUSINESS WIRE)--Spirit Electronics, a value-added microelectronics distributor, is rolling out additional capacity for its automated BGA reballing service. Spirit’s high-efficiency ...
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