On May 29, 2025, Marvell Technology, Inc. (NASDAQ:MRVL) launched the latest addition to its IP portfolio of custom AI compute platforms, a multi-die packaging platform. This production-qualified ...

Moore's Law era amid surging demand for artificial intelligence (AI) and high-performance computing (HPC), advanced packaging ...

The advanced packaging platform is part of the Marvell™ comprehensive IP portfolio for custom AI compute platforms—and enables multi-chip accelerator designs 2.8x larger than conventional single-die ...

Marvell Technology MRVL uses advanced CMOS technologies at 5nm and 3nm nodes and is now shifting toward 2nm and below, which include innovations like gate-all-around transistors and backside power ...

As we enter the AI era, the demand for enhanced connectivity in cloud services and AI computing continues to surge. With Moore’s Law slowing down, the increasing data rate requirements are surpassing ...

REHOVOT, Israel, Aug. 26, 2025 /PRNewswire/ -- Nova (NASDAQ: NVMI), today announced the release of its latest optical metrology solution, the Nova WMC. This next-generation modular platform has been ...

"Advanced packaging is one of the primary vehicles for advancing compute density in AI clusters and cloud," said Will Chu, senior vice president and general manager of Custom Cloud Solutions at ...

SANTA CLARA, Calif., May 29, 2025 /PRNewswire/ -- Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, has expanded the packaging ecosystem for AI ...